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iPhone 18 Pro chip may jump to 2nm and new packaging
Apple’s rumored A20 Pro could bring two big changes: a 2nm process from TSMC and WMCM packaging that may boost performance and efficiency.
Image: 9to5Mac
Apple’s A20 Pro chip for the iPhone 18 Pro and iPhone Ultra could be a bigger leap than a typical annual upgrade, according to 9to5Mac. The report points to two major changes expected in the chip Apple plans to ship this fall.
The first is a move to TSMC’s 2-nanometer process, which would make the A20 Pro the first 2nm iPhone chip. Apple’s current chips use a 3nm process, so the shift should allow more performance and better power efficiency within a similar chip size. 9to5Mac notes that fabrication advances like this usually give Apple extra room to improve speed, efficiency, or both, though it’s still unclear which areas the company will prioritize.
The second rumored upgrade is a packaging change: Wafer-Level Multi-Chip Module, or WMCM. According to 9to5Mac, this would be the first time Apple uses that approach for its iPhone processors.
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With WMCM, components such as the SoC and DRAM are integrated at the wafer level before chips are separated. The technique connects dies without an interposer or substrate, which can improve thermal performance and signal integrity. In practice, that means the chip could sit physically closer to its memory, potentially improving performance and lowering power use in demanding workloads such as AI processing and high-end gaming.
9to5Mac says WMCM could make the A20 Pro particularly strong at AI tasks, a notable point as iOS 27 is expected to be heavily focused on AI.
Gadgets Editor
Eli is obsessed with the tangible future. He reviews phones, wearables, and everything with a battery. Known for his rigorous testing protocols and unabashed teardowns, Eli has broken more review units than he cares to admit, all in the name of discovering the truth about durability and repairability.
via 9to5Mac
